Spectroscopic Ellispsometry
COMPACT HIGH-SPEED SPECTROSCOPIC ELLIPSOMETER
UNECS-2000 is based on Spectroscopic ellipsometry utilizing thick (high-order) retarders. It is ULVAC’s newest spectroscopic ellipsometer, which offers the high-speed in a compact size. It offers excellent cost performance, which was impossible with conventional spectroscopic ellipsometers. Its motorized stage can measure samples up to φ200mm . User find it easy to use for accurate results. It can be used for various applications such as R&D and manufacturing lines etc.
Features
High-order wave plates or waveplates are used to generate the spectrum carrying information about the wavelength-dependent multiple parameters of polarized of light. It requires no mechanical or active components for polarization-control, such as a rotating compensator and electro-optic modulator. Its snapshot method makes high- speed measurements possible.
The size of the emitter and receiver of the sensor unit are very small due to the use of high-order wave plates. The built-in light source and controller are mounted in a designed compact enclosure.
Included is a φ200mm motorized stage, a laptop PC with data analysis software. Users can enjoy excellent cost performance benefits.
Users can easily edit and add material table files.
It’s possible to measure multi-layer film thickness of up to 6 layers.
Applications
- Measurement of transparent or semitransparent films on substrates up to φ200mm (Oxide film, nitride film, photo resist film, ITO etc.)
- Spectroscopic Ellispsometry
- Spectroscopic Ellispsometry
- Automated High-speed Spectroscopic Ellipsometer
AUTOMATED HIGH-SPEED SPECTROSCOPIC ELLIPSOMETER
UNECS-3000A is high-speed spectroscopic ellipsometer that is quickly appreciable for thickness and optical parameter distribution of thin film by snap shot measurement method with automated mapping. Users can achieve highly accurate measurement results. It can be used for various applications from R&D to mass production.
Features
- Automated mapping function
- Measure and provide the film thickness and optical parameter distribution of a φ300mm substrate automatically with programmable R-θ stage. Moreover, the result of measurements can be displayed in a color map.
- High-speed measurement
- The snapshot measurement is realized by spectroscopic ellipsometry inconjunction with high-order wave plates. Measurement time is 20ms per data point.
- Excellent cost-performance
- The UNECS-3000A comes equiped with the main measurement unit, a laptop PC, and data analysis software. The main measurement unit offers automated mapping as well as auto height adjustment.
- Customized material tables
- Users can easily edit and add material table files.
- Multi-layer measurement
- It’s possible to measure multi-layer film thicknesses.
Applications
Measure transparent or semitransparent thin film thicknesses and optical parameters on substrates less than or equal to φ300mm (Oxidation film, nitride film, photo resist film, ITO etc.)
Quartz Crystal Monitor
CRTS Series, Multi-sensor for Quartz Crystal Oscillation Type Deposition Controller
CRTS SERIES, MULTI-SENSOR FOR QUARTZ CRYSTAL OSCILLATION TYPE DEPOSITION CONTROLLER
The rotary type multi-sensor “CRTS-M6” has been developed for the crystal oscillation type deposition controller “CRTM Series” .The 5MHz or 6MHz crystal is 6 pieces-mountable in the rotary type crystal holder.It can be used in such as a high rate vapor deposition and continuous multi-layer vapor deposition with safe.
Features
- Either 5 or 6 MHz 6 pieces of AT cut crystals are mountable.
- High reliability has been achieved with an original drive system that adopts the vacuum motor.
- The replacement of crystal is detachable together with the crystal holder.
- In case of the crystal failed (abnormal oscillation) is detected, it is automatically switched to next crystal by the signal from the controller(CRTM).
- The sensor head is small(50mm diameter), it is possible to install it in the evaporation deposition equipment flexibly.
Applications
High rate,multi-layer deposition control for Optical,OrganicEL,Electric devices.
Quartz Crystal Monitor
CRTM-6000G, Quartz Crystal Oscillation Type Deposition Controller
Copper Film Measurement System
CRTM-6000G, QUARTZ CRYSTAL OSCILLATION TYPE DEPOSITION CONTROLLER
The CRTM-6000G is a deposition controller with excellent cost / performance features. Unit offer a wide depostion control range for single as well as multilayer films.
Features
- Two sensors can be switched for deposition control. (The simultaneous measurement cannot be done. It is a switch type.)
- Low rate deposition process control is possible with high resolution of film thickness.
- Excellent response is obtained with a sampling rate of 125 ms.
- Up to 99 deposition programs can be stored with battery backup.
- Memory of the controller can record up to 30 process sequences.
- RS232C interface is included as standard. Control from a PC is therefore simple.
- The 12ch digital input/output signals is programmable.
- The 3ch analog output signals (Power, Rate, Thickness) is programmable.
- Up to 3 steps can be input for pre-heating and rate control for more precise control.
Applications
Film thickness and deposition rate control during evaporation.
Quartz Crystal Monitor
CRTM-9100G, QUARTZ CRYSTAL DEPOSITION CONTROLLER
CRTM-9100G is a quartz crystal deposition controller that provides low-rate deposition control and high-precision film thickness control with an outstanding film thickness/rate resolution (0.005Å ). An option enables deposition control for up to 4 materials simultaneously.
Features
- Ideal for low-rate deposition control with outstanding film thickness/rate resolution (0.005Å)
- Deposition control for 4 materials simultaneously (with option).
- Control of multilayer films with up to 99 layers
- Programs can be saved on USB memory and floppy disks.
- Can measure film thicknesses accurately, referencing history of films deposited on crystal oscillator (MLC function).
Applications
Film thickness and rate control at Evaporation
Copper Film Measurement System
As film thickness and distribution control of metal thin film deposited on wafer play important roles in the characteristics of the device and yields in the semiconductor wiring process, it is an important element of quality control. While the commonly used conventional measuring methods were contact systems and only indirect evaluation by monitor wafer could be carried out, MESEC is equipped with an automatic transfer system compatible with up to 300mm wafer and it can measure directly on wafers from practical production and, therefore, more reliable data can be obtained. Furthermore, it will contribute to a reduction in the quantity of monitor wafers. Stand-alone type MESEC-SAT and built-in type MESEC-BIT are available.
Features
- Non-contact and non-destructive measurement of the thickness of metal thin film on silicon wafer can be carried out and the process can be evaluated directly with product wafers.
- As the eddy current sensor is smallsized and the measurement speed is high, it is possible to mount to and measure on tools for PVD, CVD, ECD, CMP, etc.
- An automatic calibration method has been developed, the influences of drift of the measurement system can be removed, and the repeatability of thickness measurement is excellent.
- Thickness of all kinds of metals or alloys can be measured through simple establishment of a database for the calculation of film thickness by the user (Stand-alone type).
- MESEC-SAT Quality control for metal film thickness and sheet resistance in semiconductor manufacturing lines Feedback to R & D
- MESEC-BIT Condition monitor of deposition tool Quality control in deposition processes
- Standard Equipment Configuration
- Main unit of the film thickness measurement system
- Computer set (Monitor and Keyboard and/or Mouse)
- Software operational environment (OS): Microsoft® Windows NT
Copper Film Measurement System
MESEC-BI, NON-CONTACT METAL FILM THICKNESS MEASUREMENT SYSTEM
MESEC BIT-2000 / 3000 (built-in types) in semiconductor interconnect processes, the film thickness distribution is important for quality control of metal thin films deposited on wafers. This film thickness distribution affects device characteristics and yield. MESEC can measure film thickness directly on the product wafer, providing more reliable evaluation results and reducing monitor wafers.
Features
- Measures metal thickness and sheet resistance non-destructively and without contact.
- Built-in models have compact eddy current sensors and fast measurement speed, so can integrated into PVD, CVD, plating, CMP or other systems.
- ULVAC’s original automatic adjustment method eliminates drift of measurement system, and enables film thickness measurements with outstanding reproducibility.
- Database for film thickness calculation can be easily created, enabling measurement of almost all metal or alloy thickness.
Applications
- Metal film thickness quality control on semiconductor manufacturing lines
- Deposition system status checks, process evaluations
- Providing real-time process control information to deposition systems
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