BT150 and BT300 Features and Specifications
Features
Ease of operation
Full colour, high resolution, touch screen control system
Recipe storage and editing for up to 30 processes
Process data output to mass storage device or PC
Optional integrated film thickness monitoring system
Complete range of deposition techniques
Metal sputtering techniques for SEM
Sample etch stage for SEM
Carbon fibre and carbon rod techniques for TEM
Glow discharge accessory for surface modification of carbon films for TEM
Resistance source option for metals deposition for EM and R&D
Sputter deposition of metals such as aluminium for R&D
Optional integrated film thickness monitoring and control system
Standard automatic shutter
Vacuum pumping
Rotary pump for ‘everyday’ low-vacuum EM coating
Turbo pump for high resolution EM coating and research coating
A comprehensive range of sample stages:
Water cooled SEM stage with bias operation
Rotary and tilting stages for EM stubs
Planetary / tilting stage for EM stubs
100mm diameter rotary stage for R&D (BT150)
Rotary and planetary stages for R&D up to 8” / 200mm diameter (BT300)
SPECIFICATIONS
| BT150 | |
| Control systems: | Integrated PLC with colour touch screen. Process menu selection and editing. Password protection. Data logging via external USB port. Automatic source recognition system |
| Chamber: | Glass cylinder 165mm diameter x 150mm tall with implosion guard. Optional 200mm tall chamber. |
| Vacuum pump: | 5m3/h two stage rotary pump |
| Turbo pump option: | 62l/s compound turbomolecular pump with on-board controller |
| Vacuum performance (rotary pump): | 5x10-2mbar in <3 minutes |
| Vacuum performance (turbo pump): | 5x10-5mbar in <8 minutes |
| Power input: | 100-230V, 50/60Hz, single phase |
| Process accessories | |
| Metal sputtering: | Single magnetron source. DC sputter power supply |
| Available targets: | Easy-change, Au, Au/Pd, Ir, Cu, Fe, others |
| Sputter options: | Sputters oxidising / non-noble metals where turbo pump fitted |
| Process gas admission: | Single channel pressure control system with chamber purge facility. Separate chamber vent. |
| Carbon fibre evaporation: | Pulse deposition with selectable current, time and degas mode |
| Carbon rod evaporation: | Pulse deposition with selectable current, time and degas mode |
| Glow discharge processing: | Glow discharge for carbon film modification |
| Resistance evaporation: | Single source and static sample stage for EM or research |
| SEM sample bias / etch stage: | Static, water-cooled bias stage with removable stub holder |
| Rotary EM stages: | Rotation, rotation with tilt, height adjustment for 6 stubs |
| Planetary EM stage: | Planetary motion with adjustable sample tilt for 6 stubs |
| Rotary stage for research: | 100mm diameter, plane stage with height adjustment |
| Film thickness monitoring and control: | Optional fully-integrated quartz crystal monitor with material selection menu, rate and termination control. Control through touch screen |
| BT300 | |
| Control system: | Integrated PLC with colour touch screen. Process menu selection and editing. Password protection. Data logging via external USB port |
| Chamber: | Glass cylinder 300mm diameter x 150mm tall with implosion guard. 200mm tall option |
| Vacuum pump: | 5m3/h two stage rotary pump |
| Turbo pump option: | 62l/s compound turbomolecular pump with on-board controller |
| Vacuum performance (rotary pump): | 5x10-2mbar in <12 minutes |
| Vacuum performance (turbo pump): | 5x10-5mbar in <20 minutes |
| Power input: | 100-230V, 50/60Hz, single phase |
| Process accessories | |
| Metal sputtering: | 2 targets for sequential deposition. DC sputter power supply and switching system |
| 3 targets for area coverage of 1 metal. Single DC sputter power supply | |
| Process gas admission: | Single channel pressure control system with chamber purge facility. Separate chamber vent |
| Sample stages: | 2-target systems have 100mm rotary stage which self-positions below the active source. |
| 3-target systems have a planetary stage with 150mm or 200mm diameter platen for optimum film uniformity | |
| Film thickness monitoring and control: | Optional fully-integrated quartz crystal system with material selection menu, deposition rate measurement and termination control. Controlled through the touch screen |
| Crystal holder: | 2-target systems have 2 crystal monitor heads. 3-target systems have 1 monitor head |
| Given information is subject to change as part of our ongoing product development. E&OE |
