Residual Gas Analyzers

QULEE BGM, RESIDUAL GAS ANALYSIS/PROCESS GAS MONITOR BASIC PROCESS GAS MONITOR

"Qulee" (pronounced as "KLEE"), is ULVAC's latest model for residual gas analysis. Feedback from facility engineers in various production lines are incorporated in the new product design offering utmost simplicity. Most appropriate for system control of vacuum evaporator and various types of vacuum furnaces.

Features 



  • Excellent in Cost Performance: Suitable for RGA application 
  • Integrated Display: No need for PC
  • Simple Operation: "One Click" function
  • Max 120°C (248°F) high temperature bake (250°C (482°F) when sensors are removed)
  • Electron bombard degas
  • Ion source and secondary electron multiplier protection maintenance help function
  • Traceability of analysis tube (patent pending)
  • Various Leak Tests are Available (Helium leak test, air leak test, leak up)
  • Capable of total pressure measurement (ionization gauge)
  • Qulee QCS is Included:
  • This software is included and compatible with (Windows XP/7)
  • QIP (Quick Install Package system) is Included:
  • Auto measuring package (refer to the options catalog for details)
  • Conforms with CE

Applications

  • Residual gas monitoring for PV, FPD, and semiconductor manufacturing system
  • Residual gas analysis in PVD system and vacuum deposition
  • Residual gas analysis for high vacuum pumping equipment, etc.
  • Residual gas analysis for freeze drying system
  • Various types of gas analysis for research and development

Qulee YTP, Quadrupole Mass Spectrometer with Differential Pumping Kit

A variation of Qulee, adding new features in response to customer needs. By adding a differential pumping unit, the Qulee provides measurement and analysis capabilities for process management and residual gas analysis.

Features 



  • Provides gas analysis with an optional differential pumping unit
  • Utilizes standard vacuum unit model YTP-50M
  • Provides visual data without need for a PC
  • One-click function for easy operation, no complex procedures
  • Selectable maximum measurable pressures 500Pa, 100Pa, 10Pa, and 1Pa
  • (3.75Torr, 0.75Torr, 7.5 x 10-2Torr, and 7.5 x 10-3Torr / 5mbar, 1mbar, 0.1mbar, and 1.0 x 10-2)
  • Select from the mass numbers 1 to 100 (BGM-101/102), 1 to 200 (BGM-201/202), 1 to 300 (HGM-302)
  • Complete Leak Test Function (Helium leak test, air leak test, leak up test)
  • Software included (Windows XP/7)

Applications

  • Various types of gas analysis for research and development
  • Gas monitoring of PVD system during processing
  • Residual gas analysis in PVD system
  • Residual gas analysis for high vacuum pumping equipment, etc.
  • Atmospheric pressure (10+5Pa, 760Torr, 1013mbar) of gas analysis (Atmospheric pressure type)

Qulee CGM, Residual Gas Analysis/Process Gas Monitor Compact Process Gas Monitor

 “Qulee” (pronounced as “KLEE”), is ULVAC’s latest model for residual gas analysis and gas monitoring during process. Feedback from facility engineers in various production lines are incorporated in the new product design offering utmost simplicity. The Qulee offers high accuracy and resolution even at high pressure (1Pa or less).



Features

  • Ideal for process monitoring of various sputtering sysytem
  • No differential pumping system required (at 1Pa (7.5×10-3Torr / 1×10-2 mbar) lower)
  • Integrated Display: No need for PC
  • Simple Operation: "One Click" function
  • Max 120°C (248°F) high temperature bake (250°C (482°F) when sensors are removed)
  • Electron bombard degas
  • Ion source and secondary electron multiplier protection maintenance help function
  • Traceability of analysis tube (patent pending)
  • Various Leak Tests are Available (Helium leak test, air leak test, built-up test)
  • Capable of total pressure measurement (ionization gauge)
  • Qulee QCS is Included:
  • This software is included and compatible with (Windows XP/7)
  • QIP (Quick Install Package system) is Included:
  • Auto measuring package (refer to options catalog for details)
  • Conforms with CE

Applications

  • Process monitoring for PV, FPD, and semiconductor system
  • Residual gas analysis in PVD system
  • Impurities (H2O, etc.) control in PVD system
  • For leak testing

Qulee HGM. Residual Gas Analysis/Process Gas Monitor High Performance Process Gas Monitor

ULVAC’s new “Qulee HGM” residual gas analyzer series with revolutionary simplicity of use. Offers highest sensitivity of all models at 2.5×10-6 A/Pa, Qulee HGM can meet the needs of various R&D and other vacuum system process monitoring.



Features

  • Offers highest sensitivity 2.5x10-6A/Pa
  • No need for PC
  • "One Click" function
  • Max 250ºC high temperature baking (300ºC when the sensors are removed)
  • Electron bombard degas
  • Filament, ion source, and secondary electron multiplier are easy to replace.
  • Unit offers protection and maintenance of ion source and secondaryelectron multiplier.
  • Traceability of analysis tube (patent pending)
  • Various Leak Tests are Available (Helium leak test, air leak test, leak up)
  • Capable of total pressure measurement (ionization gauge)
  • This software is included and compatible with (Windows XP/7)
  • Conforms with CE

Applications

  • R & D such as thermal desorption gas analysis
  • Residual gas analysis for ultra-high vacuum pumping equipment, etc
  • Trace impurities in gas
  • R&D for photovoltaic field
  • Analysis of organic compound
  • Environmental measurements

MEQulee RGM-202 / RGM-302, Reactive Gas Process Monitoring System

This process monitoring system has been developed for various kinds of applications such as etch, CVD and other reactive gas processes. Using ULVAC’s original ion source and pumping system enables you to achieve stable measurements results.



Features

  • Long term stable measurements results
  • Closed Ion Source Utilizing a Magnetic Field:
  • Soft ionization provides less gas dissociation and higher sensitivity. Decomposition and adsorption due to thermal reactions are minimized in the ionization chamber.
  • Short distance between the process chamber and ion source allows quick-response of analysis.
  • Wide pressure range from 10-6 to 13kPa is available. (Choice of orifices)
  • No need for PC
  • "One Click" function
  • Max 120ºC High temperature bakeing.
  • Electron bombard degas
  • Protection and maintenance of ion source and secondary electron multiplier
  • Traceability of analysis tube (patent pending)
  • Various Leak Tests are Available (Helium leak test, air leak test, leak up)
  • Capable of total pressure measurement (External ionization gauge GI-M2)
  • This software is included and compatible with (Windows XP/7)

Applications

  • For etching and CVD process
  • Monitoring reactive gases during process
  • End-point monitoring for etching and cleaning processes
  • Residual gas analyzing
  • Leak testing